Soldering: Difference between revisions
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* hot plate reflow using 3D printer | * hot plate reflow using 3D printer | ||
* wave | * wave | ||
==De-soldering== | |||
* wire wick | |||
* solder sucker | |||
* solder pot | |||
* wave | |||
* hot air | |||
=Development targets= | =Development targets= | ||
Revision as of 21:57, 9 October 2021
Introduction
Soldering is a process in which two or more items are joined together by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not involve melting the work pieces. In brazing, the work piece metal also does not melt, but the filler metal is one that melts at a higher temperature than in soldering. In the past, nearly all solders contained lead, but environmental and health concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes.
Challenges
Approaches
Through hole
- iron
- wave
Surface mount
- hot plate reflow using 3D printer
- wave
De-soldering
- wire wick
- solder sucker
- solder pot
- wave
- hot air
