Soldering: Difference between revisions

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* [https://en.wikipedia.org/wiki/Reflow_soldering Wikipedia: Reflow soldering]
* [https://en.wikipedia.org/wiki/Reflow_soldering Wikipedia: Reflow soldering]
* [https://en.wikipedia.org/wiki/Wave_soldering Wikipedia: Wave soldering]
* [https://en.wikipedia.org/wiki/Wave_soldering Wikipedia: Wave soldering]
* [[File:NASA Technical Standard 8739.4 w- change 6.pdf|thumb]]

Revision as of 01:46, 25 September 2021

Transformation: Soldering

Introduction

Soldering is a process in which two or more items are joined together by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not involve melting the work pieces. In brazing, the work piece metal also does not melt, but the filler metal is one that melts at a higher temperature than in soldering. In the past, nearly all solders contained lead, but environmental and health concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes.

Challenges

Approaches

Through hole

  • iron
  • wave

Surface mount

  • hot plate reflow
  • wave

Development targets

References