Kirt R. Williams, Kishan Gupta, Matthew Wasilik - Etch Rates for Micromachining Processing—Part II
Mark R. Jackson - Effects of Radio Frequency Power and Sulfur Hexafluoride Flowrate on Etch Rate of Silicon Dioxide
S. A. Moshkalyov, C. Reyes-Betanzo, R.C. Teixeira, I. Doi, M.B. Zakia, J.A. Diniz, J. Swart - Etching of Polycrystalline Silicon in SF6 Containing Plasmas
I.J. Kima, H.K. Moona, J.H. Leea, N.E. Leea, J.W. Jungc, S.H. Cho - Silicon nitride etch characteristics in SF6/O2 and C3F6O/O2 plasmas and evaluation of their global warming effects